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One-Stop PCB Solutions

From NDA to delivery — PCB fabrication, BOM procurement, and assembly in China & Malaysia, all managed under one roof.
Technical Specifications

PCB Board Specifications

Our manufacturing parameters cover a wide range of applications, from simple single-sided boards to complex 40-layer HDI constructions.

Parameter
Specification
Layer Count
1 – 40 layers
Board Thickness
0.21mm – 10.0mm
Min. Line / Space
90µm / 75µm (3.5/3.0 mil)
Min. Drill Size (Mechanical)
0.20mm
Min. Drill Size (Laser)
0.10mm
Max. Aspect Ratio
16:1
Copper Weight
0.5oz- 6oz (20oz feasible for prototypes)
Min. Annular Ring
0.10mm
Impedance Tolerance
±10% (±5% achievable)
Max. Panel Size
620mm × 750mm
Board Material
FR-4, High Tg FR-4, Rogers, Aluminum, PI, PTFE
Product Showcase

Advanced PCB Types We Manufacture

From standard FR4 to the most complex constructions — every board type, every surface finish, under one roof.

HDI Microvias
HDI PCB
Microvias, blind/buried vias, and fine-line technology for smartphones, wearables, and compact devices.
Flexible PCB
Flexible PCB
Polyimide-based flexible circuits for dynamic bending applications — medical, automotive, and consumer electronics.
Rigid-Flex PCB
Rigid-Flex PCB
Seamless integration of rigid and flexible sections for 3D packaging and reduced connector count.
High-Speed PCB
High-Speed / High-Frequency
Impedance-controlled boards with low-loss materials for 5G, RF, microwave, and high-speed digital applications.
Heavy Copper PCB
Heavy Copper PCB
Up to 6oz copper for high-current power applications — automotive, industrial, and power electronics.
Multi-Layer PCB
Up to 40 layers with blind/buried vias, controlled impedance, and high-density interconnect.
Quality Assurance

Inspection & Testing Methods

Every board undergoes rigorous inspection and testing at critical production stages to guarantee quality.

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AOI Inspection
Automated Optical Inspection at inner and outer layer stages to detect defects before lamination and final finish.

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X-Ray Analysis
X-ray inspection for multi-layer boards, BGA pads, and hidden defects that visual inspection cannot detect.

Electrical Testing
Flying probe and fixture-based electrical testing to verify connectivity, isolation, and impedance compliance.

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Microsection Analysis
Cross-sectional microscopic analysis of plated through-holes, copper thickness, and layer alignment.
End-to-End Process

Project Work Flow

A disciplined, stage-gated process that takes your project from confidential design review all the way to delivery.

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NDA
Your IP is protected. We sign a Non-Disclosure Agreement before any design files are shared.

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DFM Review
Our engineers review your design for manufacturability, catching issues before production.

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Design Settled
Design files are finalized with all DFM feedback incorporated — your golden data set.

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Cost Review
Transparent cost breakdown based on final design — no surprises, no hidden fees.

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Fabrication
Boards enter production with full traceability, AOI, and in-process quality checks.

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BOM Prep
Components are sourced, verified for authenticity, and prepared for assembly.

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Assembly
SMT/THT assembly in China or Malaysia with full inspection and testing.

Testing
Functional testing, ICT, and burn-in per your specifications before shipment.

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Packing
ESD-safe packaging with moisture protection, barcode labeling, and full documentation.

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Deliver
International logistics via DHL, FedEx, UPS, or your preferred forwarder.
Supply Chain Services

BOM Procurement

Complete component sourcing and procurement management — we handle your bill of materials so you can focus on your product.
Full BOM Management

We source and procure all components from your BOM — semiconductors, passives, connectors, and electromechanical parts — from authorized distributors and verified channels. All components are tracked with lot traceability from receipt to assembly.

Global sourcing from authorized distributors
(Digi-Key, Mouser, Arrow, Avnet & more)
Alternate part recommendations for long lead-time or EOL components
Consigned inventory management — we can hold your stock
Full lot traceability: batch number, date code, distributor source
Component Quality Control

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Visual Inspection
All incoming components undergo visual inspection under microscope — checking for physical damage, marking consistency, pin straightness, and packaging integrity.

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Dimensional Verification
Sample measurements against manufacturer datasheets to verify package dimensions, lead pitch, and coplanarity meet specifications.

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Authenticity Assurance
We source exclusively from authorized channels. For critical or hard-to-find parts, additional authenticity checks include marking consistency, date code logic, and manufacturer documentation verification.

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ESD & MSL Control
All components are handled in ESD-protected environments. Moisture-sensitive devices are stored in dry cabinets and baked per J-STD-033 before assembly when required.
Beyond the Board

Assembly Services — China & Malaysia

Flexible assembly options across two locations — choose the facility that best fits your cost, compliance, and project requirements.

🇨🇳 China Assembly

China Assembly

🇲🇾 Malaysia Assembly

Malaysia Assembly

Your dedicated project manager oversees the entire process — from PCB fabrication through final assembly — regardless of which assembly location you choose. Same quality, one point of contact.

Surface Finishes

Available Surface Finishes

We offer all major surface finish options to suit your assembly requirements and reliability needs.

HASL
Hot Air Solder Leveling — cost-effective, widely compatible
ENIG
Electroless Nickel Immersion Gold — excellent solderability, wire bonding
OSP
Organic Solderability Preservative — flat surface, environmentally friendly
Immersion Silver
Flat surface, good for fine-pitch components
Immersion Tin
Flat surface, aluminum wire bonding compatible
ENEPIG
Electroless Ni/Electroless Pd/IG — superior wire bonding & corrosion resistance

Ready to Start Your Project?

From NDA to delivery — we handle every step. Get a quote or reach out to discuss your requirements.